A thermal pad is recommended under the IC to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are also recommended.
Ensure that the input voltage is within the recommended range, and that the output capacitor is of sufficient value (at least 10uF) and ESR (less than 1 ohm).
The maximum allowable ripple voltage is 10% of the input voltage, but it's recommended to keep it as low as possible to ensure stable operation.
Yes, but ensure that the ceramic capacitor is of high quality and has a low ESR (less than 1 ohm) to prevent oscillation.
Use the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current.
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