SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Seated Height-Max:
1 mm
Supply Voltage-Max (Vsup):
10 V
Supply Voltage-Min (Vsup):
6 V
Supply Voltage-Nom (Vsup):
8 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
5.6 mm
BD8205EFV-ME2 Frequently Asked Questions (FAQs)
ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the IC's supply voltage (VIN) to prevent damage.
While the BD8205EFV-ME2 is rated for operation up to 105°C, ROHM recommends derating the output current and power dissipation to ensure reliable operation in high-temperature environments. Consult the datasheet and ROHM's application notes for specific guidelines.
To troubleshoot oscillations or instability issues, check the PCB layout for parasitic inductance and capacitance, ensure proper decoupling of the input and output capacitors, and verify that the output capacitor meets the recommended specifications. Additionally, check for noise on the VIN and EN pins, and ensure that the IC is properly grounded.
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BD8205EFV-ME2 Overview
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