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BD90C0AFP-CE2 - ROHM Semiconductor

Description: ROHM BD90C0AFP-CE2, LDO Voltage Regulator Controller, 1A, 9 V, ±1% 3 + Tab-Pin, DPAK

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PCB Footprints
BD90C0AFP-CE2 - ROHM Semiconductor PCB footprint - Other - Other - TO-252-3_2019
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3D Models
BD90C0AFP-CE2 - ROHM Semiconductor  - 3D model - Other - TO-252-3_2019
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BD90C0AFP-CE2 Details

  • Manufacturer Part Number:

    BD90C0AFP-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252, 3/2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    35 V

  • Input Voltage-Max:

    26.5 V

  • Input Voltage-Min:

    10 V

  • JESD-30 Code:

    R-PSSO-G2

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.08%

  • Load Regulation-Max:

    0.18%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    2

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    1 A

  • Output Voltage1-Max:

    9.27 V

  • Output Voltage1-Min:

    8.73 V

  • Output Voltage1-Nom:

    9 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SMSIP3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.5 mm

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    3%

  • Width:

    5.5 mm

BD90C0AFP-CE2 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
  • To ensure stable operation with a high-ESR output capacitor, ROHM recommends adding a 1nF to 10nF ceramic capacitor in parallel with the output capacitor to reduce the overall ESR. Additionally, the output capacitor should be placed close to the IC to minimize parasitic inductance.
  • The maximum allowed voltage on the EN pin is 6V, which is higher than the recommended operating voltage of 5V. However, it's essential to ensure that the EN pin voltage does not exceed the IC's supply voltage (VIN) to prevent damage.
  • While the BD90C0AFP-CE2 is rated for operation up to 105°C, ROHM recommends derating the output current and power dissipation to ensure reliable operation. Consult the datasheet and ROHM's application notes for specific guidelines on high-temperature operation.
  • To troubleshoot oscillations or instability issues, check the PCB layout for parasitic inductance and capacitance, ensure proper decoupling and bypassing, and verify that the output capacitor meets the recommended specifications. Additionally, consult ROHM's application notes and technical support resources for guidance on troubleshooting and optimization.

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