BD93942F-GE2 - ROHM Semiconductor

BD93942F-GE2 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested. A minimum of 1 oz copper thickness is recommended for optimal thermal performance.
• How do I ensure stable operation with a high-ESR output capacitor?
  To ensure stable operation, use an output capacitor with an ESR of 10 ohms or less, and add a 1-10 nF ceramic capacitor in parallel to the output capacitor to reduce the ESR.
• What is the maximum allowed voltage on the EN pin?
  The maximum allowed voltage on the EN pin is 6.5V. Exceeding this voltage may damage the IC.
• Can I use the BD93942F-GE2 in a high-temperature environment?
  The BD93942F-GE2 is rated for operation up to 105°C. However, the IC's performance and reliability may degrade at high temperatures. Ensure proper thermal design and consider derating the output current at high temperatures.
• How do I calculate the output voltage ripple?
  The output voltage ripple can be calculated using the formula: ΔVout = (Iout * ESR) / (f * C), where Iout is the output current, ESR is the output capacitor's equivalent series resistance, f is the switching frequency, and C is the output capacitance.