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BDP947E6327HTSA1 - Infineon

Description: NPN Transistor 3A 45V

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BDP947E6327HTSA1 - Infineon - PCB symbol
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PCB Footprints
BDP947E6327HTSA1 - Infineon PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223-4-2020
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3D Models
BDP947E6327HTSA1 - Infineon - 3D model - SOT223 (3-Pin) - SOT-223-4-2020
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BDP947E6327HTSA1 Details

  • Manufacturer Part Number:

    BDP947E6327HTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-223, 4 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    3 A

  • Collector-Base Capacitance-Max:

    25 pF

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PDSO-G4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

  • VCEsat-Max:

    0.5 V

BDP947E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
  • Infineon recommends using a gate driver with a high current capability (e.g., 2A or higher) and a low propagation delay (e.g., <10ns) to ensure proper switching of the IGBT. The 2EDN7524F or 1EDN8555F gate drivers from Infineon are suitable options.
  • According to Infineon's application note AN2013-03, the maximum allowed voltage overshoot during turn-on and turn-off is 10% of the DC-link voltage. Exceeding this limit may reduce the device's lifetime or cause failure.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of <1K/W, ensuring good thermal contact between the device and heat sink, and providing adequate airflow. Infineon recommends a heat sink with a minimum size of 30mm x 30mm x 10mm.
  • The recommended switching frequency for the BDP947E6327HTSA1 is up to 20kHz. However, the actual switching frequency may vary depending on the application and system requirements. It's essential to consult Infineon's application notes and datasheets for specific guidance.

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BDP947E6327HTSA1 Overview

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