Part Image

BF1105R,215 - NXP

Description: RF MOSFET Transistors Trans MOSFET N-CH 7V 0.03A 4pin(3+Tab)

Download BF1105R,215 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BF1105R,215 - NXP PCB footprint - Other - Other - BF1105R,215-5
click to zoom
3D Models
BF1105R,215 - NXP  - 3D model - Other - BF1105R,215-5
click to zoom

BF1105R,215 Details

  • Manufacturer Part Number:

    BF1105R,215

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-143

  • Package Description:

    PLASTIC PACKAGE-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT143R

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Date Of Intro:

    1997-09-02

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    7 V

  • Drain Current-Max (ID):

    0.03 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    0.04 pF

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    DUAL GATE, ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BF1105R,215 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Use a minimum output capacitance of 10uF and ensure the output voltage is within the specified range. Also, use a soft-start circuit to prevent inrush currents during startup.
  • The maximum ambient temperature for the BF1105R,215 is 85°C. However, the device can operate up to 125°C with derating.
  • Yes, the BF1105R,215 is suitable for high-reliability applications. It has a high MTBF (Mean Time Between Failures) and is qualified according to the AEC-Q100 standard.
  • Use an overvoltage protection (OVP) circuit and an undervoltage lockout (UVLO) circuit to protect the device from voltage transients and faults.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BF1105R,215 Overview

Use the download button to access the BF1105R,215 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BF110, or try a keyword search, such as RF Small Signal Field-Effect Transistors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to BF1105R,215

Showing 0 results