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BF245C - onsemi

Description: N-Channel Amplifiers

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BF245C - onsemi PCB footprint - Other - Other - TO127P254X732-3
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BF245C - onsemi  - 3D model - Other - TO127P254X732-3
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BF245C Details

  • Manufacturer Part Number:

    BF245C

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-92

  • Pin Count:

    3

  • Manufacturer Package Code:

    CASE 29-11

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.1 A

  • FET Technology:

    JUNCTION

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BF245C Frequently Asked Questions (FAQs)

  • The maximum SOA for the BF245C is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to keep the device within the specified thermal limits to ensure reliable operation.
  • To ensure linear operation, the BF245C should be biased in the active region, where the base-emitter voltage (Vbe) is around 0.7V and the collector-emitter voltage (Vce) is greater than 1V. The base current should be limited to prevent saturation, and the collector current should be within the specified maximum rating. A stable voltage source and proper decoupling are also essential for linear operation.
  • For optimal performance and thermal management, it's recommended to use a multi-layer PCB with a solid ground plane and a thermal relief pattern under the device. The device should be mounted on a heat sink or a thermal pad, and the PCB should be designed to minimize thermal resistance. A minimum of 1 oz copper thickness is recommended, and the PCB should be designed to minimize electromagnetic interference (EMI).
  • The BF245C is a sensitive device and requires proper ESD protection to prevent damage. It's recommended to use ESD protection devices, such as TVS diodes or ESD protection arrays, on the input and output pins. Additionally, proper handling and storage procedures should be followed to prevent ESD damage during manufacturing and assembly.
  • The BF245C is a reliable device with a typical lifetime of 10-15 years, depending on the operating conditions and environmental factors. The device is designed to meet the requirements of automotive and industrial applications, and it's qualified according to the AEC-Q101 standard. However, the actual lifetime may vary depending on the specific application and operating conditions.

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