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BF256B - onsemi

Description: Sourced from process 50.; This device is designed for VHF/UHF amplifiers.

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PCB Footprints
BF256B - onsemi PCB footprint - Other - Other - BF256B-3
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3D Models
BF256B - onsemi  - 3D model - Other - BF256B-3
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BF256B Details

  • Manufacturer Part Number:

    BF256B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-92-3

  • Manufacturer Package Code:

    135AN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • FET Technology:

    JUNCTION

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-92

  • JESD-30 Code:

    O-PBCY-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    CYLINDRICAL

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.35 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    BOTTOM

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BF256B Frequently Asked Questions (FAQs)

  • The maximum SOA for the BF256B is not explicitly stated in the datasheet. However, it's recommended to follow the guidelines provided in the onsemi application note AND8034/D, which provides SOA curves for similar devices.
  • To ensure proper biasing, follow the recommended biasing circuit and component values provided in the datasheet. Additionally, consider the application note AND8034/D, which provides guidance on biasing and stability analysis for similar devices.
  • For optimal thermal performance, follow the recommended PCB layout and thermal management guidelines provided in the onsemi application note AND8034/D. This includes using a thermal pad, thermal vias, and a heat sink if necessary.
  • Yes, the BF256B can be used in switching applications. However, it's essential to consider the device's switching characteristics, such as the transition frequency, rise and fall times, and the maximum switching frequency. Consult the datasheet and application notes for guidance on switching applications.
  • To ensure ESD protection, follow the recommended handling and storage procedures outlined in the onsemi datasheet. Additionally, consider using ESD protection devices, such as TVS diodes, in your circuit design.

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