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BF545A,215 - NXP

Description: TRANSISTOR, JFET, N-CH, -30V, SOT-23; Drain Source Voltage Vds:30V; Continuous Drain Current Id:6.5mA; Power Dissipation Pd:250mW; Operating Frequency Min:-; Operating Frequency Max:-; RF Transistor Case:SOT-23; No. of Pins:3Pins; RoHS Compliant: Yes

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Symbol
BF545A,215 - NXP - PCB symbol
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PCB Footprints
BF545A,215 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3 lead sot-23
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3D Models
BF545A,215 - NXP - 3D model - SOT23 (3-Pin) - 3 lead sot-23
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BF545A,215 Details

  • Manufacturer Part Number:

    BF545A,215

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    30 V

  • FET Technology:

    JUNCTION

  • Highest Frequency Band:

    VERY HIGH FREQUENCY BAND

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.25 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BF545A,215 Frequently Asked Questions (FAQs)

  • A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation can help optimize the design.
  • Proper biasing involves setting the correct voltage and current levels. Refer to the datasheet for recommended operating conditions, and consider using a voltage regulator and decoupling capacitors to ensure a stable power supply.
  • To minimize EMI and RFI, use a multi-layer PCB, keep signal traces short, and use shielding or filtering components. Also, ensure proper grounding and decoupling to reduce noise and radiation.
  • Start by checking the power supply, signal integrity, and PCB layout. Use oscilloscopes and logic analyzers to debug the issue. Consult the datasheet, application notes, and NXP's support resources for guidance.
  • Operating the device beyond the recommended temperature range can lead to reduced performance, reliability issues, and even permanent damage. Ensure proper thermal management and consider using thermal protection circuits.

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BF545A,215 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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