BF861C,215 - NXP

BF861C,215 Details

• Manufacturer Part Number:

  BF861C,215

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  TO-236

• Package Description:

  PLASTIC PACKAGE-3

• Pin Count:

  3

• Manufacturer Package Code:

  SOT23

• ECCN Code:

  EAR99

• HTS Code:

  8541.21.00

• Date Of Intro:

  1995-04-01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Additional Feature:

  LOW NOISE

• Configuration:

  SINGLE

• DS Breakdown Voltage-Min:

  25 V

• FET Technology:

  JUNCTION

• Feedback Cap-Max (Crss):

  2.7 pF

• JEDEC-95 Code:

  TO-236AB

• JESD-30 Code:

  R-PDSO-G3

• JESD-609 Code:

  e3

• Moisture Sensitivity Level:

  1

• Number of Elements:

  1

• Number of Terminals:

  3

• Operating Mode:

  DEPLETION MODE

• Operating Temperature-Max:

  150 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Peak Reflow Temperature (Cel):

  260

• Polarity/Channel Type:

  N-CHANNEL

• Power Dissipation-Max (Abs):

  0.25 W

• Qualification Status:

  Not Qualified

• Surface Mount:

  YES

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Transistor Application:

  AMPLIFIER

• Transistor Element Material:

  SILICON