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BFG520/X,215 - NXP

Description: NXP - BFG520/X,215 - Bipolar - RF Transistor, NPN, 15 V, 9 GHz, 300 mW, 70 mA, 60 hFE

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PCB Footprints
BFG520/X,215 - NXP PCB footprint - Other - Other - SOT143B_2024-2
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3D Models
BFG520/X,215 - NXP  - 3D model - Other - SOT143B_2024-2
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BFG520/X,215 Details

  • Manufacturer Part Number:

    BFG520/X,215

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-143

  • Package Description:

    PLASTIC PACKAGE-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT143B

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.07 A

  • Collector-Base Capacitance-Max:

    0.6 pF

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    0.3 W

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    CECC

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    9000 MHz

BFG520/X,215 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow and keep the device away from other heat sources. Monitor the junction temperature (Tj) to prevent overheating.
  • The recommended input impedance is 50 ohms, and the output impedance is 50 ohms or lower. Impedance matching is crucial for optimal power transfer and minimal signal reflection.
  • Ensure that the power supply voltage (Vcc) is applied before the enable signal (EN). The device will start up correctly when Vcc is stable and EN is high.
  • Keep the RF input and output pins (RF_IN and RF_OUT) as short as possible and away from other signals. Use a ground plane under the device to reduce electromagnetic interference (EMI).

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BFG520/X,215 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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