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BFP196E6327HTSA1 - Infineon

Description: RF Bipolar Transistors NPN Silicon RF TRANSISTOR

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BFP196E6327HTSA1 - Infineon PCB footprint - Other - Other -  SOT143_2022
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BFP196E6327HTSA1 - Infineon  - 3D model - Other -  SOT143_2022
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BFP196E6327HTSA1 Details

  • Manufacturer Part Number:

    BFP196E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4

  • Additional Feature:

    TR, 7 INCH: 3000

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Base Capacitance-Max:

    1.4 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    70

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.7 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    7500 MHz

BFP196E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) between the package and heat sink, and follow Infineon's recommended thermal design guidelines.
  • Monitor the device's junction temperature (TJ), output current (Iout), and input voltage (Vin) to ensure reliable operation and detect potential faults.
  • Yes, the BFP196E6327HTSA1 is designed to withstand vibrations up to 10g RMS (random vibration) and 20g peak (sinusoidal vibration) according to Infineon's vibration test standards.
  • Follow standard ESD precautions, such as using ESD-safe workstations, wrist straps, and packaging materials, to prevent damage during handling and assembly.

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BFP196E6327HTSA1 Overview

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