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BFR183E6327HTSA1 - Infineon

Description: Trans RF BJT NPN 12V 0.065A 450mW Automotive 3-Pin SOT-23 T/R

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Symbol
BFR183E6327HTSA1 - Infineon - PCB symbol
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PCB Footprints
BFR183E6327HTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23(1.1mm)
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3D Models
BFR183E6327HTSA1 - Infineon - 3D model - SOT23 (3-Pin) - SOT23(1.1mm)
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BFR183E6327HTSA1 Details

  • Manufacturer Part Number:

    BFR183E6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Collector Current-Max (IC):

    0.065 A

  • Collector-Base Capacitance-Max:

    0.6 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    8000 MHz

BFR183E6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN191 'Layout Recommendations for RF Transistors' which should be followed for optimal performance.
  • The datasheet provides a recommended biasing circuit, but it's essential to consult Infineon's application note AN192 'Biasing of RF Transistors' for detailed information on biasing and stabilization techniques.
  • The device has a maximum junction temperature of 175°C. Ensure proper heat sinking and thermal management to prevent overheating. Consult Infineon's thermal management guidelines for more information.
  • Yes, the BFR183E6327HTSA1 can be used in a push-pull configuration. However, it's essential to ensure proper impedance matching and biasing to achieve optimal performance.
  • Follow the standard ESD precautions and store the devices in a dry, cool place. Avoid exposing the devices to extreme temperatures, humidity, or physical stress.

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BFR183E6327HTSA1 Overview

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