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BFR193FH6327XTSA1 - Infineon

Description: RF Bipolar Transistors RF BIP TRANSISTOR

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BFR193FH6327XTSA1 - Infineon - PCB symbol
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PCB Footprints
BFR193FH6327XTSA1 - Infineon PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - PG-TSFP-3-1
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3D Models
BFR193FH6327XTSA1 - Infineon - 3D model - SO Transistor Flat Lead - PG-TSFP-3-1
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BFR193FH6327XTSA1 Details

  • Manufacturer Part Number:

    BFR193FH6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Country Of Origin:

    Germany, Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.08 A

  • Collector-Base Capacitance-Max:

    1 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    8000 MHz

BFR193FH6327XTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • Follow the recommended operating temperature range (Tj) of -40°C to 150°C, and consider using a heat sink or thermal interface material to maintain a safe junction temperature.
  • Consider the thermal resistance (Rth) of the heatsink, the maximum power dissipation (Pd), and the airflow around the component to ensure effective heat dissipation.
  • Follow proper ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD bag, and ensure that the component is stored in an ESD-protected environment.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s, and avoid exceeding 3 reflows.

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BFR193FH6327XTSA1 Overview

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