Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer.
Infineon recommends a peak reflow temperature of 260°C, with a maximum time above 217°C of 30 seconds. The recommended soldering process is a reflow soldering process with a nitrogen atmosphere.
Infineon recommends storing the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive pressure to the leads.
Infineon recommends following standard ESD protection procedures, such as using an ESD wrist strap or mat, and ensuring that all equipment and tools are properly grounded.
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BFR193WH6327XTSA1 Overview
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