Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Infineon recommends following the thermal design guidelines, using a heat sink if necessary, and ensuring good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer.
Infineon recommends a peak reflow temperature of 260°C, with a soldering time of 30-60 seconds. The device is compatible with lead-free soldering processes.
Infineon recommends storing the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Avoid bending, flexing, or applying excessive pressure to the leads.
Infineon recommends following standard ESD handling procedures, using wrist straps, and ensuring that all equipment and tools are properly grounded. The device has an ESD rating of 2 kV human body model (HBM) and 100 V machine model (MM).
Trust Checks
This model has been verified by system checks.
System Verified
Sponsored
BFR380FH6327XTSA1 Overview
Use the download button to access the BFR380FH6327XTSA1 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BFR38,
or try a keyword search, such as RF Small Signal Bipolar Transistors
