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BFR505,215 - NXP

Description: RF TRANS NPN 15V 9GHZ TO236AB

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PCB Footprints
BFR505,215 - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23
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3D Models
BFR505,215 - NXP  - 3D model - SOT23 (3-Pin) - SOT23
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BFR505,215 Details

  • Manufacturer Part Number:

    BFR505,215

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE, HIGH RELIABILITY

  • Collector Current-Max (IC):

    0.018 A

  • Collector-Base Capacitance-Max:

    0.4 pF

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    0.15 W

  • Power Dissipation-Max (Abs):

    0.15 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    CECC

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    9000 MHz

BFR505,215 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces short and away from the digital lines. Use a 50-ohm microstrip line for the RF output.
  • Use a voltage regulator to ensure a stable 5V supply. Decouple the power pins with 100nF and 10uF capacitors. Ensure the bias resistors are correctly sized and placed close to the device.
  • The recommended input impedance is 50 ohms, and the output impedance should be matched to the load impedance (typically 50 ohms) for maximum power transfer.
  • Use a shielded enclosure, keep the RF lines short, and use a common-mode choke on the power lines. Ensure the PCB layout is optimized for minimal radiation.
  • The maximum power handling capability is 2W. Ensure the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.

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BFR505,215 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image BFR505 NXP Semiconductors

RF Small Signal Bipolar Transistor, 0.018A I(C), 1-Element, L Band, Silicon, NPN, TO-236AB