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BFS17PE6327HTSA1 - Infineon

Description: RF Bipolar Transistors NPN Silicon RF TRANSISTOR

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BFS17PE6327HTSA1 - Infineon - PCB symbol
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PCB Footprints
BFS17PE6327HTSA1 - Infineon PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23--ren1
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3D Models
BFS17PE6327HTSA1 - Infineon - 3D model - SOT23 (3-Pin) - SOT-23--ren1
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BFS17PE6327HTSA1 Details

  • Manufacturer Part Number:

    BFS17PE6327HTSA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.75

  • Factory Lead Time:

    111 Weeks

  • Date Of Intro:

    1997-02-01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Collector Current-Max (IC):

    0.025 A

  • Collector-Base Capacitance-Max:

    0.8 pF

  • Collector-Emitter Voltage-Max:

    15 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    40

  • Highest Frequency Band:

    ULTRA HIGH FREQUENCY BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.28 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    2500 MHz

  • VCEsat-Max:

    0.4 V

BFS17PE6327HTSA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C. Implement proper thermal management, such as heat sinks or thermal interfaces, to keep the junction temperature below the maximum rating.
  • The BFS17PE6327HTSA1 has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and handling. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • Yes, the BFS17PE6327HTSA1 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard for automotive applications and is suitable for use in safety-critical systems.
  • Infineon recommends soldering the BFS17PE6327HTSA1 using a reflow soldering process with a peak temperature of 260°C for 20-30 seconds. Ensure that the soldering process is performed in a nitrogen atmosphere to prevent oxidation.

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BFS17PE6327HTSA1 Overview

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