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BFU530AR - NXP

Description:  Low noise, high breakdown RF transistor  AEC-Q101 qualified  Minimum noise figure (NFmin) = 0.6 dB at 900 MHz  Maximum stable gain 18 dB at 900 MHz  11 GHz fT silicon technology

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PCB Footprints
BFU530AR - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TO236
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3D Models
BFU530AR - NXP  - 3D model - SOT23 (3-Pin) - TO236
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BFU530AR Details

  • Manufacturer Part Number:

    BFU530AR

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TO-236

  • Package Description:

    PLASTIC PACKAGE-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.04 A

  • Collector-Base Capacitance-Max:

    0.67 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.45 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    11000 MHz

BFU530AR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Ensure the VCC pin is connected to a stable 5V power supply, and the VEE pin is connected to a stable -5V power supply. Use a voltage regulator to regulate the voltage and decouple the power supply lines with capacitors.
  • The maximum power dissipation of the BFU530AR is 1.5W. Ensure proper heat sinking and thermal management to prevent overheating.
  • Use ESD protection diodes and TVS diodes to protect the device from electrostatic discharge and overvoltage. Ensure the input and output tracks are properly terminated and use a common mode choke to reduce EMI.
  • The recommended operating temperature range for the BFU530AR is -40°C to 85°C. Ensure proper thermal management and heat sinking to prevent overheating.

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BFU530AR Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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