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BFU530WX - NXP

Description: RF Transistor NPN 12V 40mA 11GHz 450mW Surface Mount SC-70

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PCB Footprints
BFU530WX - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT323 (SC-70)_2023
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3D Models
BFU530WX - NXP  - 3D model - SOT23 (3-Pin) - SOT323 (SC-70)_2023
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BFU530WX Details

  • Manufacturer Part Number:

    BFU530WX

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.04 A

  • Collector-Base Capacitance-Max:

    0.68 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.45 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    11000 MHz

BFU530WX Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible, and use a common mode choke to reduce EMI.
  • Monitor the device's junction temperature, ensure the input voltage is within the recommended range, and avoid exceeding the maximum current ratings. Use thermal design and simulation tools to optimize the PCB design.
  • Use a heat sink with a thermal resistance of <1°C/W, ensure good thermal contact between the device and heat sink, and consider using thermal interface materials. Keep the ambient temperature below 85°C.
  • Use a shielded enclosure, keep the input and output tracks as short as possible, and use a common mode choke to reduce EMI. Ensure the PCB layout is optimized for minimal radiation.
  • Use a 4-wire Kelvin connection for accurate voltage measurements. Ensure the test equipment is calibrated and has a high input impedance. Use a spectrum analyzer to measure the output spectrum.

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BFU530WX Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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