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BFU550AR - NXP

Description: NXP - BFU550AR - Bipolar - RF Transistor, NPN, 12 V, 11 GHz, 450 mW, 50 mA, SOT-23

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PCB Footprints
BFU550AR - NXP PCB footprint - Other - Other - BFU550AR-4
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3D Models
BFU550AR - NXP  - 3D model - Other - BFU550AR-4
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BFU550AR Details

  • Manufacturer Part Number:

    BFU550AR

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Collector Current-Max (IC):

    0.08 A

  • Collector-Base Capacitance-Max:

    0.74 pF

  • Collector-Emitter Voltage-Max:

    16 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.45 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    11000 MHz

BFU550AR Frequently Asked Questions (FAQs)

  • A good PCB layout for the BFU550AR involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the performance of the BFU550AR in a high-frequency application, ensure that the input and output impedances are matched, use a low-loss substrate, and minimize the length of the input and output tracks. Additionally, consider using a shielded enclosure to reduce electromagnetic interference.
  • The maximum power dissipation of the BFU550AR is dependent on the operating conditions, but as a general guideline, it is recommended to keep the junction temperature below 150°C. The maximum power dissipation can be calculated using the thermal resistance and the maximum allowed junction temperature.
  • To protect the BFU550AR from ESD, handle the device by the body, use an anti-static wrist strap or mat, and store the device in an anti-static bag. Additionally, ensure that the PCB is designed with ESD protection in mind, such as using ESD protection diodes and resistors.
  • The recommended operating voltage range for the BFU550AR is 4.75V to 5.25V, with a typical operating voltage of 5V. Operating the device outside of this range may affect its performance and reliability.

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BFU550AR Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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