Part Image

BFU550WF - NXP

Description: RF Bipolar Transistors NPN wideband silicon RF transistor

Download BFU550WF Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BFU550WF - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - sot323-ren1
click to zoom

BFU550WF Details

  • Manufacturer Part Number:

    BFU550WF

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.05 A

  • Collector-Base Capacitance-Max:

    0.74 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.45 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    11000 MHz

BFU550WF Frequently Asked Questions (FAQs)

  • A good PCB layout for the BFU550WF involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the performance of the BFU550WF, ensure that the input and output impedances are matched, use a high-quality RF choke, and optimize the PCB layout for minimal parasitic inductance and capacitance. Additionally, use a suitable heat sink to keep the device temperature within the recommended range.
  • The BFU550WF can handle a maximum input power of +25 dBm (316 mW) and a maximum output power of +28 dBm (631 mW) at 50 ohms. However, the actual power handling capability may vary depending on the specific application and operating conditions.
  • To ensure the reliability and longevity of the BFU550WF, follow proper handling and storage procedures, avoid exceeding the recommended operating conditions, and ensure that the device is properly soldered and mounted on the PCB. Additionally, use a suitable thermal interface material and heat sink to keep the device temperature within the recommended range.
  • The key considerations for thermal management of the BFU550WF include using a suitable heat sink, ensuring good thermal contact between the device and heat sink, and keeping the device temperature within the recommended range of -40°C to +125°C. A thermal interface material with a thermal conductivity of at least 1 W/m-K is recommended.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BFU550WF Overview

Use the download button to access the BFU550WF schematic symbol and PCB footprint.
To find more CAD model downloads similar to this part, try a partial part number search, like BFU55, or try a keyword search, such as RF Small Signal Bipolar Transistors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to BFU550WF

Showing 0 results