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BFU550WX - NXP

Description: NXP - BFU550WX - NPN WIDEBAND SILICON RF TRANSISTOR

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PCB Footprints
BFU550WX - NXP PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT323
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3D Models
BFU550WX - NXP  - 3D model - SOT23 (3-Pin) - SOT323
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BFU550WX Details

  • Manufacturer Part Number:

    BFU550WX

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    1

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.05 A

  • Collector-Base Capacitance-Max:

    0.74 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.45 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    11000 MHz

BFU550WX Frequently Asked Questions (FAQs)

  • A good PCB layout for the BFU550WX involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the performance of the BFU550WX, ensure that the input and output impedances are matched, use a high-quality RF choke, and optimize the PCB layout for minimal parasitic inductance and capacitance. Additionally, use a suitable heat sink to keep the device temperature within the recommended range.
  • The BFU550WX can handle a maximum input power of +25 dBm (316 mW) and a maximum output power of +28 dBm (631 mW) at a frequency range of 470-860 MHz. However, the actual power handling capability may vary depending on the specific application and operating conditions.
  • To ensure the reliability and longevity of the BFU550WX, follow the recommended operating conditions, use a suitable heat sink, and ensure that the device is operated within the recommended temperature range (-40°C to +125°C). Additionally, use a suitable ESD protection scheme to prevent damage from electrostatic discharge.
  • The key considerations for thermal management of the BFU550WX include using a suitable heat sink, ensuring good thermal conductivity between the device and the heat sink, and keeping the device temperature within the recommended range (-40°C to +125°C). A thermal interface material (TIM) can be used to improve thermal conductivity.

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BFU550WX Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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