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BFU550XAR - NXP

Description: RF Bipolar Transistors NPN wideband silicon RF transistor

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Symbol
BFU550XAR - NXP - PCB symbol
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PCB Footprints
BFU550XAR - NXP PCB footprint - Other - Other - SOT-143B_FFW
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3D Models
BFU550XAR - NXP - 3D model - Other - SOT-143B_FFW
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BFU550XAR Details

  • Manufacturer Part Number:

    BFU550XAR

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOT-143

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT143B

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Collector Current-Max (IC):

    0.05 A

  • Collector-Base Capacitance-Max:

    0.72 pF

  • Collector-Emitter Voltage-Max:

    12 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    60

  • Highest Frequency Band:

    L BAND

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.45 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    11000 MHz

BFU550XAR Frequently Asked Questions (FAQs)

  • A good PCB layout for the BFU550XAR involves keeping the input and output tracks as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To optimize the performance of the BFU550XAR, ensure that the input and output impedances are matched, use a high-quality RF choke, and optimize the PCB layout for minimal parasitic inductance and capacitance. Additionally, use a suitable heat sink to keep the device within its recommended operating temperature range.
  • The BFU550XAR can handle up to 5W of continuous power, but this can be increased to 10W peak power with proper heat sinking and thermal management. However, it's essential to follow the recommended thermal design guidelines to ensure reliable operation.
  • Common issues with the BFU550XAR include overheating, oscillation, and poor gain. To troubleshoot these issues, check the PCB layout, ensure proper heat sinking, and verify that the input and output impedances are matched. Also, check for any signs of oscillation and ensure that the device is operated within its recommended specifications.
  • Key considerations for thermal design with the BFU550XAR include ensuring a good thermal interface between the device and the heat sink, using a heat sink with a high thermal conductivity, and providing adequate airflow to dissipate heat. The device's thermal pad should be connected to a solid ground plane to improve heat dissipation.

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BFU550XAR Overview

Use the download button to access the BFU550XAR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BFU55, or try a keyword search, such as RF Small Signal Bipolar Transistors

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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