BFU610F,115 footprint, schematic symbol and 3D model by NXP

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BFU610F,115 - NXP PCB footprint - Other - Other - BFU610F,115-1

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Part Number BFU610F,115
Manufacturer NXP
Pin Count 4
Part Category Transistor BJT NPN
Package Category Other
Footprint Name Other - BFU610F,115-1
Released Date Nov 10, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

BFU610F,115 Details

Manufacturer Part Number:
BFU610F,115
Source Url Status Check Date:
2013-06-14 00:00:00
Brand Name:
NXP Semiconductor
Rohs Code:
Yes
Part Life Cycle Code:
End Of Life
Part Package Code:
DFP
Pin Count:
4
Manufacturer Package Code:
SOT343F
Country Of Origin:
Malaysia
ECCN Code:
EAR99
HTS Code:
8541.21.00
Manufacturer:
NXP Semiconductors
YTEOL:
2
Additional Feature:
LOW NOISE
Case Connection:
EMITTER
Collector Current-Max (IC):
0.01 A
Collector-Base Capacitance-Max:
0.187 pF
Collector-Emitter Voltage-Max:
5.5 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
70
Highest Frequency Band:
X BAND
JESD-30 Code:
R-PDSO-F4
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
4
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
0.136 W
Reference Standard:
IEC-134
Surface Mount:
YES
Terminal Finish:
Tin (Sn)
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
15000 MHz

BFU610F,115 Frequently Asked Questions (FAQs)

A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
Use a thermally conductive material for the heat sink, ensure good airflow, and consider using a thermal interface material to improve heat transfer. Also, follow the recommended operating conditions and derating guidelines.
Use a common mode choke, a differential mode inductor, and a capacitor with a high self-resonant frequency to filter out EMI. Ensure the filter components are placed close to the device and use a shielded cable for the input and output.
Use a low-dropout linear regulator or a switching regulator with a high efficiency to minimize power loss. Optimize the PCB layout to reduce parasitic resistances and inductances, and consider using a power-saving mode if available.
Use a heat sink with a high thermal conductivity, ensure good thermal contact between the device and heat sink, and consider using a thermal interface material. Also, ensure good airflow and avoid blocking airflow around the heat sink.

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BFU610F,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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