Part Image

BGA2800,115 - NXP

Description: IC RF AMP GP 0HZ-2.2GHZ 6TSSOP

Download BGA2800,115 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BGA2800,115 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
click to zoom
3D Models
BGA2800,115 - NXP  - 3D model - SOT23 (6-Pin) - SOT363
click to zoom

BGA2800,115 Details

  • Manufacturer Part Number:

    BGA2800,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TSSOP

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    3.3 V

  • Supply Current-Max:

    12.1 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

BGA2800,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Ensure that the RF traces are short and direct, and that the decoupling capacitors are placed close to the device.
  • Use a network analyzer to measure the impedance of the RF ports, and then use a Smith chart to design a matching network that achieves a 50-ohm impedance match.
  • The BGA2800,115 can handle up to 30 dBm of input power, but it's recommended to operate at a maximum of 20 dBm to ensure reliable operation and minimize the risk of damage.
  • Ensure that the supply voltage is within the recommended range of 4.75V to 5.25V, and that the bias voltage is set to the recommended value of 3.3V. Also, ensure that the bias current is within the recommended range of 10mA to 20mA.
  • The recommended operating temperature range for the BGA2800,115 is -40°C to 85°C. Operating the device outside of this range may affect its performance and reliability.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BGA2800,115 Overview

Use the download button to access the BGA2800,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BGA28, or try a keyword search, such as RF/Microwave Amplifiers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to BGA2800,115

Showing 0 results