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BGA2817,115 - NXP

Description: RF Amplifier MMIC wideband amp amplifier

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PCB Footprints
BGA2817,115 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
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3D Models
BGA2817,115 - NXP  - 3D model - SOT23 (6-Pin) - SOT363
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BGA2817,115 Details

  • Manufacturer Part Number:

    BGA2817,115

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TSSOP

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    3.3 V

  • Supply Current-Max:

    22.2 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

BGA2817,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Ensure that the PCB layout is symmetrical and balanced to minimize electromagnetic interference (EMI).
  • Use a pi-network or a T-network topology for impedance matching. The values of the matching components can be calculated using a Smith chart or an impedance matching tool. Ensure that the impedance is matched to 50 ohms for optimal performance.
  • Use a combination of ceramic and electrolytic capacitors for power supply decoupling. A 100nF ceramic capacitor and a 10uF electrolytic capacitor in parallel are recommended. Place the capacitors as close to the device as possible.
  • Ensure that the device is biased according to the recommended operating conditions in the datasheet. Use a voltage regulator or a voltage reference to maintain a stable voltage supply. Ensure that the bias voltage is within the recommended range.
  • The device has a maximum junction temperature of 150°C. Ensure that the device is mounted on a heat sink or a thermal pad to dissipate heat. Use thermal interface material (TIM) to improve heat transfer between the device and the heat sink.

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BGA2817,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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