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BGA2869,115 - NXP

Description: NXP - BGA2869,115 - MMIC RF AMP, 2.2GHZ, 32.2DB, SOT-363-6

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PCB Footprints
BGA2869,115 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
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3D Models
BGA2869,115 - NXP  - 3D model - SOT23 (6-Pin) - SOT363
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BGA2869,115 Details

  • Manufacturer Part Number:

    BGA2869,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    TSSOP

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    5 V

  • Supply Current-Max:

    26 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

BGA2869,115 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal design guide in their application note AN11561, which includes guidelines for thermal vias, copper pours, and component placement.
  • To minimize power consumption, ensure that the device is operated within the recommended voltage range, use the lowest possible supply voltage, and optimize the biasing and matching networks. Additionally, consider using a low-power mode or shutdown mode when not in use.
  • When designing a matching network, consider the device's input and output impedance, the frequency range of operation, and the desired return loss and insertion loss. Critical components include capacitors, inductors, and resistors, which should be selected based on their Q-factor, self-resonant frequency, and power handling capabilities.
  • To troubleshoot common issues, start by verifying the device's operating conditions, including voltage, current, and temperature. Check the PCB layout and component placement for any defects or inconsistencies. Use signal integrity analysis tools to identify potential issues with the matching network or biasing. Finally, consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • NXP recommends performing a series of tests, including DC characterization, small-signal S-parameters, and large-signal power measurements. Additionally, validate the device's performance using a network analyzer, spectrum analyzer, and other specialized equipment. Consult the datasheet and application notes for specific testing and validation procedures.

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BGA2869,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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