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BGA6130,118 - NXP

Description: The MMIC is a one-stage amplifier, offered in a low-cost leadless surface-mount package. At 3.6 V it delivers 29.5 dBm output power at 3 dB gain compression with efficiency higher than 55 %. Its power saving features include simple quiescent current adjustment, which allows class-AB operation and logic-level shutdown control to reduce the supply current to 4µA.

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Symbol
BGA6130,118 - NXP - PCB symbol
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PCB Footprints
BGA6130,118 - NXP PCB footprint - Small Outline No-lead - Small Outline No-lead - SOT908-3
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3D Models
BGA6130,118 - NXP - 3D model - Small Outline No-lead - SOT908-3
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BGA6130,118 Details

  • Manufacturer Part Number:

    BGA6130,118

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT908-3

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Power Supplies:

    3.6 V

  • Supply Current-Max:

    250 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

BGA6130,118 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN11542. It's essential to follow these guidelines to ensure optimal performance and thermal dissipation.
  • NXP recommends using their impedance matching tool, which can be found on their website. The tool helps to calculate the optimal impedance matching values for the specific application.
  • The maximum operating temperature range for the BGA6130,118 is -40°C to +125°C. However, it's essential to note that the device's performance may degrade at higher temperatures, and thermal management is crucial to ensure reliable operation.
  • While the BGA6130,118 is designed for 50 ohm systems, it can be used in non-50 ohm systems with proper impedance matching. However, this may require additional components and careful design considerations to ensure optimal performance.
  • NXP recommends using a combination of ESD protection devices, such as TVS diodes and resistors, to protect the BGA6130,118 from electrostatic discharge. The specific protection scheme may vary depending on the application and environment.

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BGA6130,118 Overview

Use the download button to access the BGA6130,118 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BGA61, or try a keyword search, such as RF/Microwave Amplifiers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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