NXP recommends a 4-layer PCB with a dedicated ground plane, and thermal vias under the package to improve heat dissipation. A thermal pad on the bottom of the package should be connected to a solid ground plane to reduce thermal resistance.
Use a multi-layer PCB with separate power and ground planes, and decouple the power supply with 10uF and 100nF capacitors. Ensure the power supply voltage is within the recommended range of 1.14V to 1.26V.
Pay attention to signal routing, especially for high-speed signals like PCIe and SATA. Use controlled impedance traces, and consider using differential pairs for clock signals. Also, ensure that the signal lines are not routed near the package's thermal balls.
The thermal shutdown feature is enabled by default. To disable it, tie the TSD pin to VCC. When enabled, the device will shut down when the junction temperature exceeds 125°C. Ensure your system design can handle this shutdown scenario.
The PLL settings depend on the specific application. Consult the NXP application note AN11535 for recommended PLL settings and clocking system configuration. Ensure the clock frequency is within the recommended range of 100MHz to 200MHz.
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BGA6489,135 Overview
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About NXP
NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more.
NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.
