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BGM1012 - NXP

Description: BGM1012 NXP, RF Amplifier, 18.7 dB, 6-Pin SOT-363

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PCB Footprints
BGM1012 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363_1
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3D Models
BGM1012 - NXP  - 3D model - SOT23 (6-Pin) - SOT363_1
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BGM1012 Details

  • Manufacturer Part Number:

    BGM1012

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, SC-88, SOT-363, 6 PIN

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    16 dB

  • Input Power-Max (CW):

    10 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    3000 MHz

  • Operating Frequency-Min:

    100 MHz

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    3 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Supply Current-Max:

    19 mA

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin (Sn)

BGM1012 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11917, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The BGM1012 is a generic front-end module that can be used with various wireless protocols. Configuration depends on the specific protocol and requires additional components and software. Refer to the protocol's documentation and NXP's application notes for guidance.
  • The BGM1012 is designed to handle up to 30 dBm (1 W) of output power. However, the actual power handling capability may vary depending on the specific application, PCB layout, and thermal management.
  • The BGM1012 is a modular component that requires additional components and design considerations to meet regulatory requirements. Ensure compliance by following regional regulations (e.g. FCC, ETSI, TELEC) and consulting NXP's application notes and regulatory guidelines.
  • The BGM1012 is specified to operate from -40°C to +85°C. However, the actual operating temperature range may vary depending on the specific application and thermal management.

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BGM1012 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image BGM1012,115 NXP Semiconductors

Wide Band Low Power Amplifier, 100MHz Min, 3000MHz Max, 1 Func, BIPolar