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BGM1013,115 - NXP

Description: BGM1013,115 NXP, RF Amplifier, 26.1 dB, 6-Pin SOT-363

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Symbol
BGM1013,115 - NXP - PCB symbol
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PCB Footprints
BGM1013,115 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363
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3D Models
BGM1013,115 - NXP - 3D model - SOT23 (6-Pin) - SOT-363
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BGM1013,115 Details

  • Manufacturer Part Number:

    BGM1013,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    PLASTIC, SC-88, SOT-363, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    24 dB

  • Input Power-Max (CW):

    -10 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    3000 MHz

  • Operating Frequency-Min:

    100 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Supply Current-Max:

    33 mA

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin (Sn)

BGM1013,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching to minimize signal reflections.
  • Use a thermal pad or a heat sink to dissipate heat. Ensure good airflow around the device, and avoid blocking the thermal pads. Operate the device within the specified temperature range of -40°C to 85°C.
  • Power up the device in the following sequence: VDD, then VBAT, and finally enable the RF signal. This ensures proper initialization and prevents damage to the device.
  • Use the device's built-in power-saving features, such as the low-power mode. Optimize the transmit power, data rate, and packet size to minimize power consumption. Use a low-power microcontroller and optimize the system's overall power budget.
  • Use a 50-ohm antenna with a quarter-wavelength monopole or a dipole antenna. Place the antenna at least 10 mm away from the device and other metal components. Ensure the antenna is properly matched to the device's output impedance.

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BGM1013,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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