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BGM1014,115 - NXP

Description: NXP BGM1014,115, RF Amplifier, 26.4 dB, 6-Pin SOT-363

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Symbol
BGM1014,115 - NXP - PCB symbol
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PCB Footprints
BGM1014,115 - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
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3D Models
BGM1014,115 - NXP - 3D model - SOT23 (6-Pin) - SOT363
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BGM1014,115 Details

  • Manufacturer Part Number:

    BGM1014,115

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP

  • Package Description:

    PLASTIC, SC-88, SOT-363, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Additional Feature:

    LOW NOISE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    25 dB

  • Input Power-Max (CW):

    -10 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    3000 MHz

  • Operating Frequency-Min:

    100 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    TSSOP6,.08

  • Power Supplies:

    5 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Supply Current-Max:

    25 mA

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Tin (Sn)

BGM1014,115 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11973, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure optimal performance.
  • The BGM1014/115 can be configured for different frequency bands by adjusting the values of the external components, such as the inductor and capacitors, according to the specific frequency band requirements. NXP provides a frequency band selection guide in the datasheet.
  • The maximum power handling capability of the BGM1014/115 is dependent on the specific application and operating conditions. However, NXP recommends a maximum input power of +20 dBm for optimal performance and reliability.
  • Impedance matching can be implemented using a pi-network or a T-network, depending on the specific application requirements. NXP provides guidelines for impedance matching in the application note AN11973.
  • The operating temperature range for the BGM1014/115 is -40°C to +85°C, as specified in the datasheet. However, NXP recommends operating the device within a temperature range of -20°C to +70°C for optimal performance and reliability.

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BGM1014,115 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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