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BGS12WN6E6327XTSA1 - Infineon

Description: IC RF SWITCH SPDT 9GHZ TSNP6-10

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BGS12WN6E6327XTSA1 - Infineon - PCB symbol
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BGS12WN6E6327XTSA1 - Infineon PCB footprint - Other - Other - BGS12WN6E6327XTSA1-1
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BGS12WN6E6327XTSA1 Details

  • Manufacturer Part Number:

    BGS12WN6E6327XTSA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Germany, Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.70.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Additional Feature:

    CMOS/TTL COMPATIBLE

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Input Power-Max (CW):

    30 dBm

  • Insertion Loss-Max:

    2 dB

  • Isolation-Min:

    16 dB

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • On Time-Nom:

    0.22 µs

  • Operating Frequency-Max:

    9000 MHz

  • Operating Frequency-Min:

    50 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    LCC6,.03X.04,16

  • Power Supplies:

    1.8/3.3 V

  • RF/Microwave Device Type:

    DIVERSITY SWITCH SPDT

  • Supply Current-Max:

    0.12 mA

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • VSWR-Max:

    1

BGS12WN6E6327XTSA1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use a 50-ohm impedance-controlled line.
  • The device requires a single 3.3V power supply. Ensure the voltage regulator is stable and can provide enough current. Decouple the power pins with 100nF and 10uF capacitors.
  • The device is rated for operation from -40°C to 125°C. However, the optimal operating range is between 0°C to 85°C for best performance and reliability.
  • Use an ESD wrist strap or mat during handling. Ensure the device is stored in an anti-static bag or tube. Follow standard ESD handling procedures during assembly.
  • Use a reflow soldering profile with a peak temperature of 260°C for 20-30 seconds. Ensure the device is not exposed to temperatures above 260°C for more than 30 seconds.

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BGS12WN6E6327XTSA1 Overview

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