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BGS4 - BEREX

Description: RF Amplifier IC 5G NR, Cellular, LTE, PCS, W-CDMA, WIMAX 50MHz ~ 4GHz SOT-363

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PCB Footprints
BGS4 - BEREX PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT-363
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3D Models
BGS4 - BEREX  - 3D model - SOT23 (6-Pin) - SOT-363
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BGS4 Details

  • Manufacturer Part Number:

    BGS4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Date Of Intro:

    2018-04-05

  • Manufacturer:

    Berex Corp

  • JESD-609 Code:

    e3

  • Terminal Finish:

    Matte Tin (Sn)

BGS4 Frequently Asked Questions (FAQs)

  • Berex Corp recommends a 4-layer PCB with a solid ground plane on the bottom layer, and a microstrip line design for the RF traces to minimize signal loss and radiation.
  • The BGS4 requires a stable DC power supply with a voltage range of 4.5V to 5.5V. A decoupling capacitor of 10nF to 100nF should be placed close to the device to filter out noise and ensure stable operation.
  • The BGS4 is designed to operate within a temperature range of -40°C to +85°C. However, it's recommended to operate within a range of 0°C to 70°C for optimal performance and reliability.
  • Berex Corp recommends using a spectrum analyzer to measure the output signal and identify any anomalies. Additionally, checking the PCB layout, power supply, and decoupling capacitors can help identify and resolve issues.
  • Yes, the BGS4 is compatible with lead-free soldering processes, but it's recommended to follow the recommended soldering profile and temperature range to ensure reliable operation.

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