Part Image

BGU7004,115 - NXP

Description: RF Amplifier Low Noise Amplifier

Download BGU7004,115 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
BGU7004,115 - NXP PCB footprint - Other - Other - BGU7004,115-3
click to zoom
3D Models
BGU7004,115 - NXP  - 3D model - Other - BGU7004,115-3
click to zoom

BGU7004,115 Details

  • Manufacturer Part Number:

    BGU7004,115

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SON

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT886

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC6,.04,20

  • Power Supplies:

    1.8 V

  • Screening Level:

    AEC-Q100

  • Supply Current-Max:

    14.4 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

BGU7004,115 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm impedance matching.
  • The LNA bias voltage (VCC_LNA) should be set between 1.8V to 3.3V. Ensure the voltage regulator is stable and decoupled with a 10uF capacitor.
  • The BGU7004,115 can handle up to 10dBm of input power. Exceeding this may cause damage to the device.
  • Use the lowest possible supply voltage (1.8V) and optimize the bias current (IBIAS) for the required gain and noise figure. Disable the device when not in use.
  • Use a TVS diode (e.g., NXP's PESD5V0L1BA) with a capacitance of 100pF to 1nF between the RF input and ground.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

BGU7004,115 Overview

Use the download button to access the BGU7004,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like BGU70, or try a keyword search, such as RF/Microwave Amplifiers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

Parts related to BGU7004,115

Showing 0 results