BGU7258 - NXP

BGU7258 Details

• Manufacturer Part Number:

  BGU7258

• Rohs Code:

  Yes

• Part Life Cycle Code:

  End Of Life

• Package Description:

  XSON-6

• Country Of Origin:

  Malaysia, Thailand

• HTS Code:

  8542.39.00.01

• Date Of Intro:

  2018-08-29

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  2

• JESD-30 Code:

  S-PDSO-N6

• Length:

  1.6 mm

• Number of Functions:

  1

• Number of Terminals:

  6

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVSON

• Package Equivalence Code:

  SOLCC6,.06,20

• Package Shape:

  SQUARE

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  NOT SPECIFIED

• Seated Height-Max:

  0.5 mm

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Telecom IC Type:

  RF AND BASEBAND CIRCUIT

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  NOT SPECIFIED

• Width:

  1.6 mm