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BGU8103X - NXP

Description: NXP - BGU8103X - RF AMPLIFIER, 1.61GHZ, XSON-6

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PCB Footprints
BGU8103X - NXP PCB footprint - Other - Other - SOT1232: XSON6
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3D Models
BGU8103X - NXP  - 3D model - Other - SOT1232: XSON6
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BGU8103X Details

  • Manufacturer Part Number:

    BGU8103X

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SON

  • Package Description:

    SOT-1232, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT1232

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Characteristic Impedance:

    50 Ω

  • Construction:

    COMPONENT

  • Gain:

    14.5 dB

  • Input Power-Max (CW):

    10 dBm

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Frequency-Max:

    1610 MHz

  • Operating Frequency-Min:

    1559 MHz

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOLCC6,.03,16

  • Power Supplies:

    0.8,1.8/2.85 V

  • RF/Microwave Device Type:

    NARROW BAND LOW POWER

  • Screening Level:

    IEC-60134

  • Supply Current-Max:

    1.6 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • VSWR-Max:

    1.78

BGU8103X Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces as short as possible and use 50-ohm microstrip lines. Avoid vias and thermal pads under the device.
  • Use a Smith chart to design the matching network. Start with a simple L-match or π-match topology and use simulation tools like ADS or AWR to optimize the component values. Consider using a tunable matching network for optimal performance.
  • The BGU8103X can handle up to 2W of continuous power. However, the maximum power handling depends on the application, PCB layout, and thermal management. Ensure proper heat sinking and thermal design to prevent overheating.
  • Use a low-noise amplifier (LNA) in front of the BGU8103X to reduce the noise figure. Optimize the matching network to minimize losses and ensure a good impedance match. Consider using a noise-cancelling topology or a differential amplifier configuration.
  • The recommended operating voltage is 3.3V to 5V, and the recommended operating current is 30mA to 50mA. However, the actual voltage and current requirements depend on the specific application and operating conditions.

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BGU8103X Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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