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BH2219FVM-TR - ROHM Semiconductor

Description: ROHM BH2219FVM-TR, 2-channel 8 bit Serial DAC, 8-Pin MSOP

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PCB Footprints
BH2219FVM-TR - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-8_1
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3D Models
BH2219FVM-TR - ROHM Semiconductor  - 3D model - Small Outline Packages - MSOP-8_1
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BH2219FVM-TR Details

  • Manufacturer Part Number:

    BH2219FVM-TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • HTS Code:

    8542.39.00.40

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5

  • Analog Output Voltage-Max:

    5.5 V

  • Analog Output Voltage-Min:

    2.6 V

  • Converter Type:

    D/A CONVERTER

  • Input Bit Code:

    BINARY

  • Input Format:

    SERIAL

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Linearity Error-Max (EL):

    0.5859%

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Settling Time-Max:

    100 µs

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    2.8 mm

BH2219FVM-TR Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure proper power-on and power-off, it is recommended to use a soft-start circuit to limit the inrush current, and to add a capacitor to filter out noise on the power supply lines. Additionally, a voltage supervisor can be used to monitor the power supply voltage and ensure the device is properly powered on and off.
  • To prevent damage, it is recommended to handle the device by the body and not the leads, and to store the device in an anti-static bag or wrap in an anti-static material. The device should be stored in a cool, dry place away from direct sunlight.
  • To troubleshoot issues, it is recommended to first check the power supply voltage and ensure it is within the recommended range. Next, check the input and output signals to ensure they are within the recommended specifications. If issues persist, check the PCB layout and thermal design to ensure they are optimal.
  • The BH2219FVM-TR is manufactured according to ROHM Semiconductor's quality standards, which include compliance with ISO 9001 and IATF 16949. The device is also qualified according to AEC-Q100, ensuring its reliability in automotive applications.

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BH2219FVM-TR Overview

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