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BLF6G27-10G,112 - Ampleon USA Inc.

Description: RF Mosfet 28 V 130 mA 19dB 2W CDFM2 Frequency 2.5GHz ~ 2.7GHz Gain 19dB Voltage - Test 28 V Current Rating (Amps) 3.5A Current - Test 130 mA Power - Output 2W Voltage - Rated 65 V

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BLF6G27-10G,112 - Ampleon USA Inc. PCB footprint - Other - Other - SOT975C_2025
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BLF6G27-10G,112 Details

  • Manufacturer Part Number:

    BLF6G27-10G,112

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, CERAMIC PACKAGE-2

  • ECCN Code:

    EAR99

  • Manufacturer:

    Ampleon

  • Case Connection:

    SOURCE

  • Configuration:

    SINGLE

  • DS Breakdown Voltage-Min:

    65 V

  • Drain Current-Max (ID):

    3.5 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Highest Frequency Band:

    S BAND

  • JESD-30 Code:

    S-CDSO-G2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

BLF6G27-10G,112 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the BLF6G27-10G,112 is -40°C to +125°C.
  • To optimize the performance of the BLF6G27-10G,112 in a high-power amplifier circuit, ensure proper thermal management, use a suitable heat sink, and optimize the impedance matching network for maximum power transfer.
  • For optimal performance, use a multi-layer PCB with a solid ground plane, keep the signal paths short and direct, and use a suitable decoupling capacitor to minimize noise and oscillations.
  • To troubleshoot common issues with the BLF6G27-10G,112, check for proper thermal management, ensure correct biasing and voltage supply, and verify the impedance matching network for optimal power transfer.
  • Handle the BLF6G27-10G,112 by the package, avoid touching the die, and use anti-static precautions to prevent damage. Follow standard SMT assembly procedures, and ensure proper cleaning and drying of the PCB before assembly.

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BLF6G27-10G,112 Overview

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