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BM2LB150FJ-CE2 - ROHM Semiconductor

Description: ROHM - BM2LB150FJ-CE2 - Power Load Distribution Switch IC, Low Side, 2 Outputs, 5.5 V in, 10 A, 0.15 ohm, SOP-8

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BM2LB150FJ-CE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SOP-J8 *
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BM2LB150FJ-CE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - SOP-J8 *
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BM2LB150FJ-CE2 Details

  • Manufacturer Part Number:

    BM2LB150FJ-CE2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Date Of Intro:

    2016-02-16

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL

  • Driver Number of Bits:

    2

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    6.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    80 µs

  • Turn-on Time:

    80 µs

  • Width:

    3.9 mm

BM2LB150FJ-CE2 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device.
  • A ceramic capacitor with a value of 4.7uF to 10uF is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize noise and ensure stable operation.
  • To protect the device from overvoltage and overcurrent, use a TVS diode or a zener diode on the input line, and consider adding a fuse or a PTC resettable fuse to limit the current in case of a fault.
  • The recommended operating frequency range for the BM2LB150FJ-CE2 is 100kHz to 1MHz. Operating the device outside of this range may affect its performance and stability.

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