A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
The device requires a stable input voltage (VIN) and a bypass capacitor (CBYP) to ensure proper biasing. A 10uF capacitor is recommended for CBYP.
The maximum power dissipation is 1.5W. Exceeding this limit may cause the device to overheat and reduce its lifespan.
The device is rated for operation up to 125°C. However, the maximum junction temperature (TJ) should not exceed 150°C to ensure reliable operation.
Handle the device with an anti-static wrist strap or mat, and ensure the PCB has ESD protection circuits, such as TVS diodes or ESD protection arrays.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
BM2P074KF-GE2 Overview
Use the download button to access the BM2P074KF-GE2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like BM2P0,
or try a keyword search, such as Switching Regulator or Controllers
