ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink or thermal management system to keep the device temperature within the recommended range.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time above 240°C of 30-60 seconds, and a total process time of 60-120 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
The BM2SC124FP2-LBZE2 is not specifically designed for high-humidity environments. However, it's possible to use it in such environments with proper precautions, such as conformal coating, hermetic sealing, or using a moisture-resistant package. Consult ROHM's application notes and environmental testing guidelines for more information.
ROHM recommends storing the BM2SC124FP2-LBZE2 in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight, high-temperature environments, or areas with high humidity.
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BM2SC124FP2-LBZE2 Overview
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