BM61S41RFV-CE2 footprint, schematic symbol and 3D model by ROHM Semiconductor

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BM61S41RFV-CE2 Details

A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and the input and output capacitors should be placed as close to the device as possible.
The device should be mounted on a heat sink or a metal core PCB to dissipate heat. The thermal pad on the bottom of the device should be connected to a solid ground plane or a heat sink to ensure efficient heat dissipation.
A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for the input capacitor. The capacitor should be placed as close to the device as possible and connected between the VIN pin and the GND pin.
The output capacitor value and type depend on the specific application requirements. A 10uF to 22uF X5R or X7R ceramic capacitor is a good starting point. The capacitor should be placed as close to the device as possible and connected between the VOUT pin and the GND pin.
The maximum ambient temperature range for the BM61S41RFV-CE2 is -40°C to 85°C. However, the device can operate up to 125°C with derating.

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