BM70BLES1FC2-0B03AA - Microchip

BM70BLES1FC2-0B03AA Details

• Manufacturer Part Number:

  BM70BLES1FC2-0B03AA

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  MODULE-33

• Pin Count:

  33

• Manufacturer Package Code:

  MODULE-33

• Country Of Origin:

  Thailand

• ECCN Code:

  5A992.C

• HTS Code:

  8517.70.00.00

• Factory Lead Time:

  20 Weeks

• Date Of Intro:

  2017-01-12

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  18

• Additional Feature:

  SEATED HGT-NOM

• JESD-30 Code:

  R-XXMA-N33

• JESD-609 Code:

  e4

• Length:

  22 mm

• Number of Terminals:

  33

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  UNSPECIFIED

• Package Code:

  XMA

• Package Shape:

  RECTANGULAR

• Package Style:

  MICROELECTRONIC ASSEMBLY

• Seated Height-Max:

  2.4 mm

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  1.9 V

• Supply Voltage-Nom:

  3 V

• Surface Mount:

  YES

• Technology:

  HYBRID

• Terminal Finish:

  Nickel/Gold (Ni/Au)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  1.1 mm

• Terminal Position:

  UNSPECIFIED

• Width:

  12 mm

• uPs/uCs/Peripheral ICs Type:

  RFSOC