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BM83SM1-00TB - Microchip

Description: Bluetooth® Stereo Audio Module Data Sheet

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BM83SM1-00TB - Microchip PCB footprint - Other - Other - BM83SM1-00TB-2
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BM83SM1-00TB - Microchip  - 3D model - Other - BM83SM1-00TB-2
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BM83SM1-00TB Details

  • Manufacturer Part Number:

    BM83SM1-00TB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PACKAGE-50

  • Pin Count:

    50

  • Manufacturer Package Code:

    MODULE-50

  • Country Of Origin:

    Taiwan, Thailand

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    24

  • JESD-30 Code:

    R-XXMA-N50

  • Length:

    32 mm

  • Number of Terminals:

    50

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    XMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    2.5 mm

  • Supply Voltage-Max:

    4.2 V

  • Supply Voltage-Min:

    3.2 V

  • Supply Voltage-Nom:

    3.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    UNSPECIFIED

  • Width:

    15 mm

  • uPs/uCs/Peripheral ICs Type:

    RFSoC

BM83SM1-00TB Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the BM83SM1-00TB evaluation board user's guide. It's essential to follow the layout guidelines to minimize noise, ensure proper thermal management, and optimize performance.
  • To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unnecessary peripherals, and use the power-saving modes (e.g., sleep, idle) when possible. Refer to the datasheet for specific register settings and power-saving techniques.
  • The BM83SM1-00TB has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material (e.g., thermal tape, thermal grease) and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow around the PCB.
  • To troubleshoot crystal oscillator issues, check the crystal resonator's specifications, ensure proper PCB layout and routing, and verify the oscillator configuration registers. Use an oscilloscope to measure the clock signal and verify it's within the specified frequency range.
  • To ensure EMI and EMC compliance, follow proper PCB layout and routing guidelines, use shielding and filtering components as necessary, and ensure the device is properly grounded. Refer to the datasheet and application notes for specific guidance on EMI and EMC considerations.

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BM83SM1-00TB Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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