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BQ4013YMA-85 - Texas Instruments

Description: IC NVSRAM 1M PARALLEL 32DIP

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PCB Footprints
BQ4013YMA-85 - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - MA (R-PDIP-T**)
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3D Models
BQ4013YMA-85 - Texas Instruments  - 3D model - Dual-In-Line Packages - MA (R-PDIP-T**)
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BQ4013YMA-85 Details

  • Manufacturer Part Number:

    BQ4013YMA-85

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC, DIP-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Access Time-Max:

    85 ns

  • JESD-30 Code:

    R-PDMA-P32

  • Length:

    42.8 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    NON-VOLATILE SRAM MODULE

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    128KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP32,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    9.53 mm

  • Standby Current-Max:

    0.004 A

  • Supply Current-Max:

    0.105 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    15.24 mm

BQ4013YMA-85 Frequently Asked Questions (FAQs)

  • A good PCB layout for the BQ4013YMA-85 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces to reduce parasitic inductance and capacitance.
  • To ensure proper thermal management, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package. The thermal pad should be soldered to a copper plane on the PCB to dissipate heat efficiently.
  • The recommended input capacitor value is 10uF to 22uF, and a low-ESR ceramic capacitor (X5R or X7R dielectric) is recommended to minimize voltage ripple and ensure stability.
  • To troubleshoot issues, check the input voltage, output voltage, and current draw. Verify that the input and output capacitors are properly sized and placed. Check for thermal issues by measuring the device temperature and ensuring good airflow. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • Yes, the BQ4013YMA-85 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard for automotive applications and is suitable for use in harsh environments.

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BQ4013YMA-85 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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