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BQ500100DCKR - Texas Instruments

Description: Wireless Charging Current Monitor

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PCB Footprints
BQ500100DCKR - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
BQ500100DCKR - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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BQ500100DCKR Details

  • Manufacturer Part Number:

    BQ500100DCKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2016-01-16

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn); Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

BQ500100DCKR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-current paths short and wide, and use thermal vias to dissipate heat.
  • Use a reliable communication protocol like I2C or SPI, and ensure proper signal termination and noise filtering. Also, consider using a buffer or repeater for long communication lines.
  • The device has a high power dissipation, so ensure good thermal conductivity by using a heat sink, thermal interface material, and a well-designed PCB with thermal vias. Keep the ambient temperature below 85°C.
  • Use the built-in overcurrent protection (OCP) and short-circuit protection (SCP) features. Implement a fault detection mechanism using the FAULT pin and respond to faults by shutting down the device or taking corrective action.
  • Use a shielded enclosure, ensure good PCB layout and grounding, and add EMI filters or common-mode chokes to reduce emissions. Follow the guidelines in the TI application note 'EMI and EMC Considerations for the BQ500100DCKR'.

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BQ500100DCKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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Part Image BQ500100DCKT Texas Instruments

Analog Circuit, 1 Func, 1 Channel, PDSO6