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BR93H56RFVM-2CTR - ROHM Semiconductor

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BR93H56RFVM-2CTR - ROHM Semiconductor  - 3D model
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BR93H56RFVM-2CTR Details

  • Manufacturer Part Number:

    BR93H56RFVM-2CTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    MSOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    1

  • Clock Frequency-Max (fCLK):

    2 MHz

  • Data Retention Time-Min:

    100

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.9 mm

  • Memory Density:

    2048 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    128 words

  • Number of Words Code:

    128

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128X16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Parallel/Serial:

    SERIAL

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.9 mm

  • Serial Bus Type:

    MICROWIRE

  • Standby Current-Max:

    0.00001 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    4 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    2.8 mm

  • Write Cycle Time-Max (tWC):

    4 ms

  • Write Protection:

    SOFTWARE

BR93H56RFVM-2CTR Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The BR93H56RFVM-2CTR has built-in ESD protection diodes, but it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize voltage drops and current surges.
  • Yes, the BR93H56RFVM-2CTR is qualified for automotive and high-reliability applications. ROHM provides a dedicated automotive grade version of the device, which meets the AEC-Q100 standard. Please contact ROHM for more information.
  • ROHM recommends soldering the device using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Ensure that the PCB is designed to withstand the soldering process, and that the device is handled and stored according to ROHM's recommended procedures.

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BR93H56RFVM-2CTR Overview

Use the download button to access the BR93H56RFVM-2CTR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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