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BR93L66RFVT-WE2 - ROHM Semiconductor

Description: EEPROM MICROWIRE 4K BIT 256X16 2.5V/3.3V/5V

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BR93L66RFVT-WE2 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-B8
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BR93L66RFVT-WE2 - ROHM Semiconductor  - 3D model - Small Outline Packages - TSSOP-B8
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BR93L66RFVT-WE2 Details

  • Manufacturer Part Number:

    BR93L66RFVT-WE2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    1

  • Clock Frequency-Max (fCLK):

    2 MHz

  • Data Retention Time-Min:

    40

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e2

  • Length:

    4.4 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    256 words

  • Number of Words Code:

    256

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256X16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    SERIAL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Serial Bus Type:

    MICROWIRE

  • Standby Current-Max:

    0.000002 A

  • Supply Current-Max:

    0.0015 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    SOFTWARE

BR93L66RFVT-WE2 Frequently Asked Questions (FAQs)

  • ROHM provides a recommended PCB layout in their application note AN11984, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The BR93L66RFVT-WE2 has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a heat sink can be used to further improve thermal management. ROHM recommends a maximum junction temperature of 125°C.
  • ROHM recommends using a 10uF to 22uF ceramic capacitor with an X5R or X7R dielectric as the input capacitor. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • The BR93L66RFVT-WE2 is rated for operation up to 105°C, but ROHM recommends derating the output current and voltage to ensure reliable operation at high temperatures. Consult the datasheet and ROHM's application notes for more information on high-temperature operation.
  • ROHM provides a troubleshooting guide in their application note AN11984, which covers common issues such as output voltage errors, oscillations, and overheating. Additionally, ROHM's support team can be contacted for further assistance.

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